PBSS2515M: 15 V、0.5 A NPN低VCEsat (BISS)晶体管
低VCEsat NPN晶体管，采用SOT883无引脚超小型塑料封装。PNP补充：PBSS3515M。
PBSS2515M: 产品结构框图
SOT883
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 15 V, 0.5 A NPN low VCEsat (BISS) transistor (REV 3.0) PDF (144.0 kB) PBSS2515M [English] | 15 Sep 2003 |
应用说明 (2)
| 名称/描述 | Modified Date |
|---|---|
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English] | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Application guide; Portable devices and mobile handsets (REV 2.0) PDF (15.4 MB) 75017090 [English] | 13 Mar 2012 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS2515M NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS2515M_1 [English] | 31 Jan 2015 |
| PBSS2515M NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS2515M_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PBSS2515M SPICE model (REV 1.4) prm PBSS2515M_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS2515M | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | NPN | 1 | 250 | 15 | 0.5 | 1 | 200 | 420 | 250 | 360 | 250 | 500 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS2515M | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PBSS2515M,315 (9340 571 45315) | S2 | PBSS2515M |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- Application guide; Portable devices and mobile handsets pesd24vs1ul
- PBSS2515M NXP® Product Reliability PBSS2515M
- PBSS2515M NXP Product Quality PBSS2515M
- PBSS2515M SPICE model PBSS2515M
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PBSS2540M
- PMZ950UPE
