PBSS302NZ: 20 V、5.8 A NPN低VCEsat (BISS)晶体管
NPN低VCEsat突破性小信号(BISS)晶体管，采用SOT223 (SC-73)小型表面贴装器件(SMD)塑料封装。
PNP补充：PBSS302PZ。
PBSS302NZ: 产品结构框图
PBSS302NZ: 应用结构框图
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 20 V, 5.8 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (164.0 kB) PBSS302NZ [English] | 08 Dec 2009 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS302NZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302NZ_1 [English] | 31 Jan 2015 |
| PBSS302NZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302NZ_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PBSS302NZ SPICE model (REV 1.4) prm PBSS302NZ_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302NZ | Active | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 700 | 1 | 20 | 5.8 | 11.6 | 300 | 570 | 140 | 0.030.038 | 250 | 43 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302NZ | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PBSS302NZ,135 (9340 590 43135) | S302NZ | PBSS302NZ |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS302NZ NXP® Product Reliability PBSS302NZ
- PBSS302NZ NXP Product Quality PBSS302NZ
- PBSS302NZ SPICE model PBSS302NZ
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- PBHV9115Z
- BLT81
