PBSS303ND: 60 V、3 A NPN低VCEsat (BISS)晶体管
NPN低VCEsat突破性小信号(BISS)晶体管，采用SOT457 (SC-74)小型表面贴装器件(SMD)塑料封装。
PNP补充：PBSS303PD。
PBSS303ND: 产品结构框图
PBSS303ND: 应用结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 60 V, 3 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (157.0 kB) PBSS303ND [English] | 14 Dec 2007 |
应用说明 (1)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS303ND NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS303ND_1 [English] | 31 Jan 2015 |
| PBSS303ND NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS303ND_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- PBSS303ND SPICE model (REV 1.4) prm PBSS303ND_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | transistor polarity | Transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS303ND | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | NPN | 360 | 1 | 60 | 1 | 6 | 345 | 570 | 140 | 68 | 515 | 90 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS303ND | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS303ND,115 (9340 600 12115) | AE | PBSS303ND |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS303ND NXP® Product Reliability PBSS303ND
- PBSS303ND NXP Product Quality PBSS303ND
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PBSS303ND SPICE model PBSS303ND
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- PESDXS5UD_SERIES
- PBSS8110Y
- SSL5021_SSL5031
