PBSS5540Z: 40 V PNP低VCEsat (BISS)晶体管 _ BDTIC 中国领先电子元器件代理商

PBSS5540Z: 40 V PNP低VCEsat (BISS)晶体管

PNP低VCEsat晶体管，采用SOT223塑料封装。NPN补充：PBSS4540Z。

PBSS5540Z: 产品结构框图

SOT223

数据手册 (1)

名称/描述	Modified Date
40 V low VCEsat PNP transistor (REV 4.0) PDF (144.0 kB) PBSS5540Z [English]	21 Sep 2001

应用说明 (2)

名称/描述	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]	12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English]	06 Jan 2006

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]	08 Feb 2016

包装 (2)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]	07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]	07 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
PBSS5540Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5540Z_1 [English]	31 Jan 2015
PBSS5540Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5540Z_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

PBSS5540Z SPICE model (REV 1.4) prm PBSS5540Z_1_2 7/22/2012

订购信息

型号	状态	Package version	Package name	大小 (mm)	Transistor polarity	transistor polarity	number of transistors	P_tot [max] (mW)	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	f_T [min] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS5540Z/ZL	Active	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP		1350	-40	-5	-10	250	350	120		55	-120
PBSS5540Z	Active	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP	1	1350	-40	-5	-10	250	350	120	60	55	-120	80
PBSS5540Z/A2	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP		1350	-40	-5	-10	250	350	120		55	-120
PBSS5540Z/A	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP		1350	-40	-5	-10	250	350	120		55	-120
PBSS5540Z/G	No Longer Manufactured	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP		1350	-40	-5	-10	250	350	120		55	-120

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PBSS5540Z		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PBSS5540Z,115 (9340 554 96115)	PB5540	PBSS5540Z		week 34, 2003	153.0	0.71	1.41E9	1	1
PBSS5540Z		SOT223		Reel 11¼" Q1/T1 in LargePack	Active	PBSS5540ZF (9340 554 96135)	PB5540	PBSS5540Z			153.0	0.71	1.41E9
PBSS5540Z/ZL		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	PBSS5540Z/ZLF (9340 707 63135)	Standard Marking	PBSS5540Z/ZL			153.0	0.71	1.41E9
PBSS5540Z/ZL		SOT223		Reel 7" Q1/T1	Active	PBSS5540Z/ZLX (9340 707 63115)	Standard Marking	PBSS5540Z/ZL			153.0	0.71	1.41E9

40 V low VCEsat PNP transistor PBSS5540Z

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

PBSS5540Z NXP® Product Reliability PBSS5540Z

PBSS5540Z NXP Product Quality PBSS5540Z

PBSS5540Z SPICE model PBSS5540Z

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A

PBSS5540Z

BLT81

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