PESD3V3L1UB: 低电容单向ESD保护二极管

低电容单向静电放电(ESD)保护二极管采用小型表面贴装设备(SMD)塑料封装,保护单条信号线,使其免受ESD和其他瞬态电压导致的损坏。

PESD3V3L1UB: 产品结构框图
PESD3V3L1UB: 应用结构框图
PESD3V3L1UB: 应用结构框图
sod523_3d
数据手册 (1)
名称/描述Modified Date
Low capacitance unidirectional ESD protection diodes (REV 1.0) PDF (113.0 kB) PESD3V3L1UA_UB_UL [English]23 Jun 2009
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD3V3L1UB NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L1UB [English]31 Jan 2015
PESD3V3L1UB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L1UB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD3V3L1UBActiveSOD523SOD5231.2 x 0.8 x 0.61Unidirectional34403.3300.3
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3L1UBSOD523Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD3V3L1UB,115 (9340 632 21115)Z7PESD3V3L1UBAlways Pb-free244.01.138.85E811
Low capacitance unidirectional ESD protection diodes pesd3v3l1ul
PESD3V3L1UB NXP® Product Reliability pesd3v3l1ub
PESD3V3L1UB NXP® Product Quality pesd3v3l1ub
PESD3V3L1UB SPICE model PESD3V3L1UB
plastic surface-mounted package; 2 leads pesd5z7.0
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
PTVSXS1UR_SERIES
PESD5V0X1BL
1PSXSB17
BB208-02