PESD3V3X1BL: 超低电容双向ESD保护二极管

超低电容双向静电放电(ESD)保护二极管采用超小型无引脚表面贴装设备(SMD)塑料封装,保护单条信号线免受ESD和其他瞬态电压导致的损坏。

PESD3V3X1BL: 产品结构框图
PESD3V3X1BL: 应用结构框图
sod882_3d
数据手册 (1)
名称/描述Modified Date
Ultra low capacitance bidirectional ESD protection diode (REV 1.0) PDF (85.0 kB) PESD3V3X1BL [English]15 Jan 2009
封装信息 (1)
名称/描述Modified Date
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD3V3X1BL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3X1BL_1 [English]31 Jan 2015
PESD3V3X1BL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3X1BL_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD3V3X1BLActiveSOD882DFN1006-21.0 x 0.6 x 0.51Bidirectional1.31.63.390.1
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3X1BLSOD882Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD3V3X1BL,315 (9340 632 65315)SSPESD3V3X1BLAlways Pb-free117.00.541.85E911
Ultra low capacitance bidirectional ESD protection diode pesd3v3x1bl
PESD3V3X1BL NXP® Product Reliability pesd3v3x1bl
PESD3V3X1BL NXP® Product Quality pesd3v3x1bl
DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
PESD5V0X1BL
1PS10SB82