PESD5V0X1BCL: 极低电容双向ESD保护二极管

极低电容双向静电放电(ESD)保护二极管采用超小型无引脚SOD882 (DFN1006-2)表面贴装设备(SMD)塑料封装,保护单条信号线免受ESD和其他瞬态电压导致的损坏。该器件结合极低电容、高ESD最大额定值和超小型封装等特性,适合用于保护高速数据线。

sod882_3d
数据手册 (1)
名称/描述Modified Date
Extremely low capacitance bidirectional ESD protection diode (REV 1.0) PDF (395.0 kB) PESD5V0X1BCL [English]13 Mar 2012
封装信息 (1)
名称/描述Modified Date
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD5V0X1BCL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0X1BCL_1 [English]31 Jan 2015
PESD5V0X1BCL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X1BCL_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0X1BCLActiveSOD882DFN1006-21.0 x 0.6 x 0.51Bidirectional0.490.65.580.01
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0X1BCLSOD882Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD5V0X1BCL,315 (9340 663 09315)11PESD5V0X1BCLAlways Pb-free117.00.541.85E911
Extremely low capacitance bidirectional ESD protection diode PESD5V0X1BCL
PESD5V0X1BCL NXP® Product Reliability PESD5V0X1BCL
PESD5V0X1BCL NXP® Product Quality PESD5V0X1BCL
PESD5V0X1BCL SPICE model PESD5V0X1BCL
DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
1PS10SB82