PESDxL4UF; PESDxL4UG; PESDxL4UW: 低电容单向四倍ESD保护二极管阵列 _ BDTIC 中国领先电子元器件代理商

PESDxL4UF; PESDxL4UG; PESDxL4UW: 低电容单向四倍ESD保护二极管阵列

低电容单向四倍静电放电(ESD)保护二极管阵列采用小型表面贴装设备(SMD)塑料封装，保护最多四条信号线免受ESD和其他瞬态电压导致的损坏。

sot665_3d

数据手册 (1)

名称/描述	Modified Date
Low capacitance unidirectional quadruple ESD protection diode arrays (REV 4.0) PDF (111.0 kB) PESDXL4UF_G_W [English]	28 Feb 2008

应用说明 (1)

名称/描述	Modified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]	30 Dec 2010

封装信息 (3)

名称/描述	Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English]	08 Feb 2016
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]	08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]	08 Feb 2016

包装 (3)

名称/描述	Modified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]	23 Apr 2013
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]	03 Dec 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English]	16 Nov 2012

可靠性与质量信息 (10)

名称/描述	Modified Date
PESD3V3L4UG NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L4UG [English]	31 Jan 2015
PESD3V3L4UG NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L4UG_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
PESD3V3L4UW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L4UW [English]	31 Jan 2015
PESD3V3L4UW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L4UW_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
PESD5V0L4UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UF [English]	31 Jan 2015
PESD5V0L4UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UF_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
PESD5V0L4UG NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UG [English]	31 Jan 2015
PESD5V0L4UG NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UG_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
PESD5V0L4UW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UW [English]	31 Jan 2015
PESD5V0L4UW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UW_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (4)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English]	03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]	03 Jun 2013

SPICE

PESD3V3L4UG SPICE model (REV 1.4) prm PESD3V3L4UG_1 7/22/2012
PESD3V3L4UW SPICE model (REV 1.4) prm PESD3V3L4UW_1 7/22/2012
PESD5V0L4UF SPICE model (REV 1.4) prm PESD5V0L4UF_1 7/22/2012
PESD5V0L4UG SPICE model (REV 1.4) prm PESD5V0L4UG_1 7/22/2012
PESD5V0L4UW SPICE model (REV 1.4) prm PESD5V0L4UW_1 7/22/2012

订购信息

型号	状态
PESD5V0L4UF	Active
PESD3V3L4UG	Active
PESD3V3L4UW	Active
PESD5V0L4UW	Active
PESD5V0L4UG	Active

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PESD5V0L4UF		SOT886	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	PESD5V0L4UF,115 (9340 611 98115)	A6	PESD5V0L4UF		Always Pb-free	244.0	1.13	8.85E8	1	1
PESD5V0L4UG		SOT353	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PESD5V0L4UG,115 (9340 577 85115)	L2%	PESD5V0L4UG		week 31, 2003	244.0	1.13	8.85E8	1	1
PESD3V3L4UW		SOT665	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	PESD3V3L4UW,115 (9340 577 91115)	A2	PESD3V3L4UW		Always Pb-free	244.0	1.13	8.85E8	1	1
PESD5V0L4UW		SOT665	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	PESD5V0L4UW,115 (9340 577 92115)	A1	PESD5V0L4UW		Always Pb-free	244.0	1.13	8.85E8	1	1
PESD3V3L4UG		SOT353	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PESD3V3L4UG,115 (9340 577 84115)	L1%	PESD3V3L4UG		week 31, 2003	244.0	1.13	8.85E8	1	1

Low capacitance unidirectional quadruple ESD protection diode arrays pesd5v0l4uw

MicroPak soldering information NTS0102_Q100

PESD3V3L4UG NXP® Product Reliability pesd3v3l4ug

PESD3V3L4UG NXP® Product Quality pesd3v3l4ug

PESD3V3L4UW NXP® Product Reliability pesd3v3l4uw

PESD3V3L4UW NXP® Product Quality pesd3v3l4uw

PESD5V0L4UF NXP® Product Reliability pesd5v0l4uf

PESD5V0L4UF NXP® Product Quality pesd5v0l4uf

PESD5V0L4UG NXP® Product Reliability pesd5v0l4ug

PESD5V0L4UG NXP® Product Quality pesd5v0l4ug

PESD5V0L4UW NXP® Product Reliability pesd5v0l4uw

PESD5V0L4UW NXP® Product Quality pesd5v0l4uw

MAR_SOT353 Topmark 74LVC1G17_Q100

MAR_SOT886 Topmark prtr5v0u2f

PESD3V3L4UG SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW

PESD3V3L4UW SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW

PESD5V0L4UF SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW

PESD5V0L4UG SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW

PESD5V0L4UW SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f

XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f

plastic surface-mounted package; 5 leads pesd5v0v4uw

Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw

plastic surface-mounted package; 5 leads NX3L1G66GW-Q100

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4ug

BGU8007

IP4256CZ3_M_CZ5_W_CZ6_F

NCX2202

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