Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
名称/描述 | Modified Date |
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60 V, 1 A low VF dual MEGA Schottky barrier rectifier (REV 2.0) PDF (225.0 kB) PMEG6010CPAS [English] | 20 Jan 2015 |
名称/描述 | Modified Date |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
名称/描述 | Modified Date |
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DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English] | 08 Feb 2016 |
型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | VR (V) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | Remark |
---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG6010CPAS | Active | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 1 | 60 | dual c.c. | 540@IF=1A | 9 | 40@VR=10V | 0,1@VR=60V | solderable side pads |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG6010CPAS | SOT1061D | Reel 7" Q1/T1 | Active | PMEG6010CPASX (9340 681 47115) | CV | PMEG6010CPAS | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |