BAS116: 低漏电流二极管
低漏电流的外延中速开关二极管，采用小型SOT23 SMD塑料封装。
BAS116: 产品结构框图
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Low-leakage diode (REV 4.0) PDF (118.0 kB) BAS116 [English] | 12 Dec 2003 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS116 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS116_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS116 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS116_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BAS116 SPICE model (REV 1.4) prm BAS116_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR [max] (V) | VR max (V) | IFSM [max] (A) | IFSM max (A) | VFmax (mV) | VF [max] (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr [max] (ns) | trr max (ns) | IF [max] (mA) | IF max (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS116 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 75 | 75 | 4 | 4 | 1000@IF=10mA | 1000@IF=10mA | 5@VR=75V | 5@VR=75V | 500 | 500 | single | 3000 | 3000 | 215 | 215 | 2 | 2 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS116 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BAS116,235 (9340 321 70235) | JV% | BAS116 |    | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BAS116,215 (9340 321 70215) | JV% | BAS116 | | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Low-leakage diode BAS116
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS116 NXP Product Quality BAS116
- BAS116 NXP® Product Reliability BAS116
- BAS116 SPICE model BAS116
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- BAS116
- PMBFJ309
