BAS29; BAS31; BAS35: （两个）通用受控雪崩二极管
通用开关二极管采用平面技术制造，配以小型矩形SMD SOT23塑料封装。BAS29由一个单个二极管组成。BAS31具有两个串联二极管。BAS35具有两个共阳极二极管。
BAS29_BAS31_BAS35: 产品结构框图
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| General purpose controlled avalanche (double) diodes (REV 5.0) PDF (132.0 kB) BAS29_31_35 [English] | 20 Mar 2003 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BAS29 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS29_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS29 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS29_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BAS31 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS31_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS31 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS31_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BAS35 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS35_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS35 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS35_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
订购信息
| 型号 | 状态 |
|---|---|
| BAS29 | Active |
| BAS35 | Active |
| BAS31 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS29 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS29,215 (9337 231 80215) | %A8 | BAS29 |    | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| BAS31 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BAS31,235 (9337 231 90235) | %V1 | BAS31 | | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BAS31,215 (9337 231 90215) | %V1 | BAS31 | | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 | ||||
| BAS35 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BAS35,215 (9337 232 00215) | %V2 | BAS35 | | week 34, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS29 NXP Product Quality BAS29
- BAS29 NXP® Product Reliability BAS29
- BAS31 NXP Product Quality BAS31
- BAS31 NXP® Product Reliability BAS31
- BAS35 NXP Product Quality BAS35
- BAS35 NXP® Product Reliability BAS35
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- BAS29_BAS31_BAS35
- PMBFJ309
