BAS321: 通用二极管 _ BDTIC 中国领先电子元器件代理商

BAS321: 通用二极管

BAS321是采用平面技术制造的通用二极管，配以SOD323塑料封装。

sod323_3d

数据手册 (1)

名称/描述	Modified Date
General purpose diode (REV 2.0) PDF (119.0 kB) BAS321 [English]	26 Jan 2004

应用说明 (1)

名称/描述	Modified Date
Circuit description of CCM420 monitor (REV 1.0) PDF (501.0 kB) AN97032 [English]	14 Oct 1997

手册 (1)

名称/描述	Modified Date
Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... (REV 1.0) PDF (1.1 MB) 75016543 [English]	01 Jun 2008

选型工具指南 (1)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 [English]	08 Feb 2016

包装 (2)

名称/描述	Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 [English]	07 Nov 2012
Tape reel; standard product orientation 12NC ending 135 (REV 1.0) PDF (183.0 kB) SOD323_135 [English]	07 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
BAS321 NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS321_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BAS321 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS321_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

Design Support

LSYMDIO_1 (REV 0.1) PDF LSYMDIO_1 5/1/1999

SPICE

BAS321 SPICE model (REV 1.4) prm BAS321_1 7/22/2012

订购信息

型号	状态	Package version	Package name	大小 (mm)	V_R max (V)	V_R [max] (V)	I_FSM max (A)	I_FSM [max] (A)	V_F [max] (mV)	V_Fmax (mV)	I_R [max] (nA)	I_R max (nA)	IFRM (mA)	I_FRM (mA)	Configuration	t_rr [max] (ns)	t_rr max (ns)	I_F [max] (mA)	I_F max (mA)	C_d max. (pF)	C_d [max] (pF)
BAS321	Active	SOD323	SOD323	1.7 x 1.25 x 0.95	200	200	9	9	1000@IF=100mA	1000@IF=100mA	100@VR=200V	100@VR=200V	625	625	single	50	50	250	250	2	2
BAS321/DG	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	200	200	9	9	1000@IF=100mA	1000@IF=100mA	100@VR=200V	100@VR=200V	625	625	single	50	50	250	250	2	2
BAS321/A	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	200	200	9	9	1000@IF=100mA	1000@IF=100mA	100@VR=200V	100@VR=200V	625	625	single	50	50	250	250	2	2
BAS321/A2	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	200	200	9	9	1000@IF=100mA	1000@IF=100mA	100@VR=200V	100@VR=200V	625	625	single	50	50	250	250	2	2

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
BAS321		SOD323	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	BAS321,135 (9340 553 52135)	A7	BAS321		Always Pb-free	347.0	1.61	6.21E8	1	1
				Reel 7" Q1/T1	Active	BAS321,115 (9340 553 52115)	A7	BAS321		week 31, 2003	347.0	1.61	6.21E8	1	1
				Reel 7" Q1/T1 in Multi reel pack	Active	BAS321Z (9340 553 52145)	A7	BAS321		Always Pb-free	347.0	1.61	6.21E8	1	1

General purpose diode BAS321

Circuit description of CCM420 monitor BAS321

Create smarter, more efficient white goods; An industry-leading portfolio of cost-effective, power-saving solutions for... PMEG6010CE_AUTOMOTIVE

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

BAS321 NXP Product Quality BAS321

BAS321 NXP® Product Reliability BAS321

LSYMDIO_1 BAW56W

BAS321 SPICE model BAS321

plastic surface-mounted package; 2 leads pesd5v0v1ba

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 135 pesd5v0u1ba

Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba

BB208-03

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