BAT74S: 双倍肖特基势垒二极管
双平面肖特基势垒二极管，带集成应力保护环。
两个独立的芯片采用SOT363 (SC-88)小型SMD塑料封装。
BAT74S: 产品结构框图
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Schottky barrier double diode (REV 6.1) PDF (163.0 kB) BAT74S [English] | 23 Nov 2012 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT363_135 [English] | 20 Nov 2012 |
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAT74S NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT74S_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAT74S NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT74S_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
SPICE
- BAT74S SPICE model (REV 1.1) prm BAT74S_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAT74S | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 2@VR=25V | dual isolated | 400@IF=10mA | 0.6 | 10@VR=1V | 30 | 200 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAT74S | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BAT74S,135 (9340 458 30135) | 74% | BAT74S |    | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BAT74S,115 (9340 458 30115) | 74% | BAT74S | | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAT74S NXP Product Quality BAT74S
- BAT74S NXP® Product Reliability BAT74S
- MAR_SOT363 Topmark BSS84AKS
- BAT74S SPICE model BAT74S
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- BAT74S
- BFU520Y
