BAV170QA: Dual common cathode low-leakage diode

Dual common cathode low-leakage diode encapsulated in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

sot1215_3d
数据手册 (1)
名称/描述Modified Date
Dual common cathode low-leakage diode (REV 1.0) PDF (190.0 kB) BAV170QA [English]03 May 2016
封装信息 (1)
名称/描述Modified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]08 Feb 2016
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)VR [max] (V)VR max (V)IFSM [max] (A)IF max (mA)ConfigurationVF [max] (mV)trr max (ns)IR [max] (nA)VFmax (mV)IFRM (mA)IR max (nA)IFSM max (A)trr [max] (ns)IF [max] (mA)IFRM (mA)Cd [max] (pF)Cd max. (pF)
BAV170QAActiveSOT1215DFN1010D-31.1 x 1.0 x 0.37754dual c.c.1000@IF=10mA5@VR=75V100030003202
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAV170QASOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActiveBAV170QAZ (9340 698 14147)Z 011BAV170QAAlways Pb-free347.01.616.21E811
Dual common cathode low-leakage diode BAV170QA
BAV170QA SPICE model BAV170QA
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE