数据手册DataSheet 下载：BGA6289 MMIC宽带中等功率放大器.pdf

硅单片微波集成电路(MMIC)宽带中等功率放大器，具有内部匹配电路。

产品特点
  • 宽带50Ω增益模块
  • 单电源电压
产品应用
  • 宽带中等功率增益模块
  • 蜂窝、PCS和CDPD
  • 适用于CATV放大器的驱动器
  • IF/RF缓冲放大器
  • 振荡放大器、末级PA
  • 小信号高线性度放大器
  • 可变增益和高输出功率与BGA2031的结合
  • 无线数据SONET
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BGA6289(SOT89)sot089_posot089_fr
sot089_fw		Tape reel smd激活%3ABGA6289,135( 9340 575 01135 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF（小时）潮湿敏感度等级MSL LF
BGA6289BGA6289,135week 28, 2003NANA
产品技术资料
文档标题类型分类格式更新日期
BGA6289 (中文)：MMIC wideband medium power amplifierData sheetpdf2009-06-15
75017347：Enabling the Mobile ExperienceBrochurepdf2013-02-05
75017565：NXP's RF Manual 18th editionSelection guidepdf2014-06-17
Spar_BGA6289：S-parameter BGA6289S-parameterzip2012-06-06
BGA6289：BGA6289 SPICE modelSPICE modelprm2012-06-08
SOT89_135：Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-11-28
SOT89_115：Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-28
SOT89_147：SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147Packingpdf2014-03-04
SOT89_146：Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146Packingpdf2014-03-04
sot089_fr：Footprint for reflow soldering SOT089Reflow solderingpdf2010-07-13
sot089_po：plastic surface-mounted package; die pad for good heat transfer; 3 leadsOutline drawingpdf2009-10-08
sot089_fw：Footprint for wave soldering SOT089Wave solderingpdf2009-10-08
MMIC wideband medium power amplifier bga6289
Enabling the Mobile Experience rf
NXP's RF Manual 18th edition OL2300NHN
S-parameter BGA6289 BGA6289
BGA6289 SPICE model BGA6289
Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147 BCX56-16
Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146 BCX53-16
Footprint for reflow soldering SOT089 BFU590Q
plastic surface-mounted package; die pad for good heat transfer; 3 leads BFU590Q
Footprint for wave soldering SOT089 BFU590Q
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