BZA408B: 四倍双向ESD瞬态电压抑制器
4位宽度单芯片双向ESD瞬态电压抑制器，采用6引脚SOT457 (SC-74)封装。
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Quadruple bidirectional ESD transient voltage suppressor (REV 2.0) PDF (130.0 kB) BZA408B [English] | 15 Oct 1998 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BZA408B NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA408B_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA408B NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA408B_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- BZA408B SPICE model (REV 1.4) prm BZA408B_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA408B | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Bidirectional | 75 | 5 | 15 | 0.1 | |
| BZA408B/A2 | No Longer Manufactured | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Bidirectional | 75 | 5 | 15 | 0.1 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA408B | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | BZA408B,125 (9340 551 71125) | Z8 | BZA408B |    | week 22, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BZA408B,115 (9340 551 71115) | Z8 | BZA408B | | week 22, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- BZA408B NXP Product Quality bza408b
- BZA408B NXP® Product Reliability bza408b
- MAR_SOT457 Topmark 74LVC2G17_Q100
- BZA408B SPICE model BZA408B
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- SSL5021_SSL5031
