BZA462A: 四倍ESD瞬态电压抑制器
单芯片瞬态电压抑制器二极管采用6引脚SOT457 (SC-74)封装，可在6.2 V电平下提供4位宽度的ESD瞬态抑制。
最大反向峰值功耗： 24 W （ESD额定值大于15 kV，符合IEC1000-4-2标准） 最大反向峰值功耗： 24 W (tp =1 ms) 峰值脉冲电流下的最大钳位电压： 9 V (Izsm = 2.66 A =1 ms) 峰值脉冲电流下的最大钳位电压： 9 V (Izsm = 2.66 A)。 | SOT457 |
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Quadruple ESD transient voltage suppressor (REV 3.0) PDF (142.0 kB) BZA462A [English] | 25 May 1999 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English] | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BZA462A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA462A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA462A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA462A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- BZA462A SPICE model (REV 1.4) prm BZA462A_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA462A | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Unidirectional | 200 | 4 | 15 | 0.7 | |
| BZA462A/G | No Longer Manufactured | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Unidirectional | 200 | 4 | 15 | 0.7 | |
| BZA462A/DG | No Longer Manufactured | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Unidirectional | 200 | 4 | 15 | 0.7 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA462A | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA462A,115 (9340 548 22115) | Z2 | BZA462A |    | week 22, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| Reel 7" Q3/T4, Reverse | Active | BZA462A,125 (9340 548 22125) | Z2 | BZA462A | | week 22, 2003 | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- BZA462A NXP Product Quality bza462a
- BZA462A NXP® Product Reliability bza462a
- MAR_SOT457 Topmark 74LVC2G17_Q100
- BZA462A SPICE model BZA462A
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- SSL5021_SSL5031
