PESD5V0V1BB: 极低电容双向ESD保护二极管

极低电容双向静电放电(ESD)保护二极管采用小型表面贴装设备(SMD)塑料封装,保护单条信号线免受ESD和其他瞬态电压导致的损坏。

PESD5V0V1BB: 产品结构框图
PESD5V0V1BB: 应用结构框图
PESD5V0V1BB: 应用结构框图
sod523_3d
数据手册 (1)
名称/描述Modified Date
Very low capacitance bidirectional ESD protection diodes (REV 2.0) PDF (266.0 kB) PESD5V0V1BA_BB_BL [English]12 Nov 2012
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD5V0V1BB NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0V1BB [English]31 Jan 2015
PESD5V0V1BB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0V1BB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0V1BBActiveSOD523SOD5231.2 x 0.8 x 0.61Bidirectional11135300.01
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0V1BBSOD523Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0V1BB,115 (9340 632 45115)Z9PESD5V0V1BBAlways Pb-free117.00.541.85E911
Very low capacitance bidirectional ESD protection diodes pesd5v0v1bl
PESD5V0V1BB NXP® Product Reliability pesd5v0v1bb
PESD5V0V1BB NXP® Product Quality pesd5v0v1bb
PESD5V0V1BB SPICE model PESD5V0V1BB
plastic surface-mounted package; 2 leads pesd5z7.0
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
PESD5V0X1BL
1PSXSB17
BB208-02