PNP/PNP匹配双晶体管,采用小型表面贴装器件(SMD)塑料封装。采用SOT666和SOT363 (SC-88)封装的晶体管在内部完全隔离。
名称/描述 | Modified Date |
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PNP/PNP matched double transistors (REV 3.0) PDF (112.0 kB) PMP5501V_G_Y [English] | 21 Sep 2009 |
名称/描述 | Modified Date |
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plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English] | 08 Feb 2016 |
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English] | 08 Feb 2016 |
名称/描述 | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English] | 29 Nov 2012 |
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT363_135 [English] | 20 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English] | 16 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (191.0 kB) SOT353_135 [English] | 15 Nov 2012 |
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
名称/描述 | Modified Date |
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PMP5501G NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMP5501G_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
PMP5501G NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PMP5501G_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
PMP5501V NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMP5501V_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
PMP5501V NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PMP5501V_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
PMP5501Y NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMP5501Y_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
PMP5501Y NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PMP5501Y_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
名称/描述 | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English] | 03 Jun 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
型号 | 状态 |
---|---|
PMP5501V | Active |
PMP5501Y | Active |
PMP5501G | Active |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMP5501V | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMP5501V,115 (9340 600 11115) | ED | PMP5501V | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||
PMP5501G | SOT353 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PMP5501G,135 (9340 590 21135) | R4% | PMP5501G | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||
Reel 7" Q1/T1 | Active | PMP5501G,115 (9340 590 21115) | R4% | PMP5501G | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |||||
PMP5501Y | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | PMP5501Y,135 (9340 590 37135) | S6% | PMP5501Y | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||
Reel 7" Q1/T1 | Active | PMP5501Y,115 (9340 590 37115) | S6% | PMP5501Y | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |