RB751 series: 单倍肖特基势垒二极管 _ BDTIC 中国领先电子元器件代理商

RB751 series: 单倍肖特基势垒二极管

单个平面肖特基势垒二极管，带集成应力保护环，采用小型表面贴装器件（SMD）塑料封装。

RB751_SERIES: 产品结构框图

RB751_SERIES: 应用结构框图

RB751_SERIES: 应用结构框图

sod523_3d

数据手册 (1)

名称/描述	Modified Date
Schottky barrier single diodes (REV 1.0) PDF (64.0 kB) RB751_SER [English]	21 May 2007

选型工具指南 (1)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016

封装信息 (3)

名称/描述	Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 [English]	08 Feb 2016
plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English]	08 Feb 2016
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English]	08 Feb 2016

包装 (3)

名称/描述	Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 [English]	07 Nov 2012
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English]	07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English]	07 Nov 2012

可靠性与质量信息 (6)

名称/描述	Modified Date
RB751CS40 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB751CS40 [English]	31 Jan 2015
RB751CS40 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB751CS40_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
RB751S40 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB751S40_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
RB751S40 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB751S40_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015
RB751V40 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB751V40_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
RB751V40 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB751V40_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

RB751CS40 SPICE model (REV 1.4) prm RB751CS40_1 7/22/2012
RB751S40 SPICE model (REV 1.4) prm RB751S40 7/22/2012
RB751V40 SPICE model (REV 1.4) prm RB751V40 7/22/2012

订购信息

型号	状态
RB751CS40	Active
RB751S40	Active
RB751V40	Active

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
RB751V40		SOD323	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	RB751V40,115 (9340 613 05115)	W8	RB751V40		Always Pb-free	157.0	0.73	1.37E9	1	1
RB751CS40		SOD882	Reflow_Soldering_Profile	Reel 7" Q1/T1 Pitch 2mm	Active	RB751CS40,315 (9340 613 04315)	F6	RB751CS40		Always Pb-free	157.0	0.73	1.37E9	1	1
RB751S40		SOD523	Reflow_Soldering_Profile	Reel 7" Q1/T1	Active	RB751S40,115 (9340 613 03115)	G4	RB751S40		Always Pb-free	157.0	0.73	1.37E9	1	1

Schottky barrier single diodes RB751V40

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

RB751CS40 NXP® Product Reliability RB751CS40

RB751CS40 NXP Product Quality RB751CS40

RB751S40 NXP Product Quality RB751S40

RB751S40 NXP® Product Reliability RB751S40

RB751V40 NXP Product Quality RB751V40

RB751V40 NXP® Product Reliability RB751V40

RB751CS40 SPICE model RB751CS40

RB751S40 SPICE model RB751S40

RB751V40 SPICE model RB751V40

plastic surface-mounted package; 2 leads pesd5v0v1ba

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba

DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l

Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l

plastic surface-mounted package; 2 leads pesd5z7.0

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 115 pesd5z7.0

PESD5V0X1BL

1PSXSB17

1PSXSB17

BB208-03

1PS10SB82

BB208-02

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