The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.
The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.
Key Features
Description | Version | Size |
---|---|---|
DS3988: 2-line IPAD™, EMI filter including ESD protection | 6.0 | 241 KB |
Description | Version | Size |
---|---|---|
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use | 5.0 | 261 KB |
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use | 8.0 | 251 KB |
Description | Version | Size |
---|---|---|
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches | 4.0 | 330 KB |
型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|---|
EMIF02-USB03F2 | Chip Scale Package 0.5mm pitch | Tape And Reel | 0.402 | 100 | NEC | EAR99 | CHINA |
型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
EMIF02-USB03F2 | Chip Scale Package 0.5mm pitch | Industrial | Ecopack2 | md_qc-wspc-csps0.5-wspc-11-16_kdqc-wspc-emi2t4h_vers2_sdm_signed.pdf md_qc-wspc-csps0.5-wspc-11-16_kdqc-wspc-emi2t4h_vers2.xml |