EMIF08-0402T16:8 lines IPAD™ low capacitance EMI filter and ESD protection in thin micro QFN

The EMIF08-0402T16 is an 8 lines highly integrated device designed to suppress EMI / RFI noise in all systems exposed to electromagnetic interference.

This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the input or output pins.

Key Features

  • High efficiency in EMI filtering
  • ESD performances: up to 15 kV
  • Micro QFN 400 μm pitch
  • Low PCB space consuming with narrow package (1.35 mm width)
  • Thin package: 0.5 mm max.
  • ECOPACK® 2 compliant component
  • Benefits
    • High reduction of parasitic elements through integration
    • Improved application robustness against ESD
    • High reliability offered by monolithic integration
    • Low profile and small packaging save space on the PCB
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • 8 kV (contact discharge)
产品规格
DescriptionVersionSize
DS9168: 8 lines IPAD™ low capacitance EMI filter and ESD protection in thin micro QFN1.0288 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF08-0402T16uQFN-16LTape And Reel0.378100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF08-0402T16uQFN-16LIndustrialEcopack2md_a0k4-wspc-dfn.33.135.05-040-16l-e_esk4emi4t2a-wspc-(emif08-0402t16).pdf
md_a0k4-wspc-dfn.xml
8 lines IPAD™ low capacitance EMI filter and ESD protection in thin micro QFN EMIF08-0402T16
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_a0k4-wspc-dfn.33.135.05-040-16l-e_esk4emi4t2a-wspc-(emif08-0402t16).pdf EMIF08-0402T16
md_a0k4-wspc-dfn.xml EMIF08-0402T16