KBMF：2-line EMI filter and ESD protection with Termination and R pull-up for keyboards
On the implementation of computer systems, the radiated and conducted EMI should be kept within the required levels as stated by the FCC regulations. In addition to the requirements of EMC compatibility, the computing devices are required to tolerate ESD events and remain operational without user intervention.
The KBMF implements a low pass filter to limit EMI levels and provide ESD protection which exceeds IEC 61000-4-2 level 4 standard. The device also implements the pull up resistors needed to bias the data and clock lines. The package is the SOT23-6L which is ideal for situations where board space is at a premium.
Key Features
- Integrated low pass filters for Data and Clock lines
- Integrated pull-up resistors
- Integrated ESD protection
- Breakdown voltage: VBR = 6V min.
- Small package size
产品规格
| Description | Version | Size |
|---|---|---|
| DS1889: EMI FILTER AND LINE TERMINATION FOR PS/2 MOUSE OR KEYBOARD PORTS | 3.0 | 92 KB |
应用手册
| Description | Version | Size |
|---|---|---|
| AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use | 5.0 | 261 KB |
| AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use | 8.0 | 251 KB |
Technical Notes & Articles
| Description | Version | Size |
|---|---|---|
| TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches | 4.0 | 330 KB |
简报
| Description | Version | Size |
|---|---|---|
| HDMI® IPAD™ product presentation : HDMI signal conditioning | 1.0 | 1 MB |
样片和购买
| 型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| KBMF01SC6 | SOT23-6L | Tape And Reel | 0.497 | 1000 | NEC | EAR99 | MALAYSIA |
质量和可靠性
| 型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| KBMF01SC6 | SOT23-6L | Industrial | Ecopack2 | md_wb-wspc-sot-wspc-23-6l_hcwbkbmf01c-wspc-(kbmf01sc6)-wspc-wcp-wspc-ver2_signed.pdf md_wb-wspc-sot-wspc-23-6l_hcwbkbmf01c-wspc-(kbmf01sc6)-wspc-wcp-wspc-ver2.xml |
- circuit_diagram_7005_thumbnail.png KBMF
- IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
- IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
- Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
- Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches HSP061-4M10
- md_wb-wspc-sot-wspc-23-6l_hcwbkbmf01c-wspc-(kbmf01sc6)-wspc-wcp-wspc-ver2_signed.pdf KBMF
- md_wb-wspc-sot-wspc-23-6l_hcwbkbmf01c-wspc-(kbmf01sc6)-wspc-wcp-wspc-ver2.xml KBMF
