The L3G3200D is a low-power three-axis angular rate sensor.
It includes a sensing element and an IC interface able to provide the measured angular rate to the external world through a digital interface (I2C/SPI).
The sensing element is manufactured using a dedicated micromachining process developed by ST to produce inertial sensors and actuators on silicon wafers. The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The L3G3200D has a full scale of ±250/±500/ ±2000 dps and is capable of measuring rates with a user selectable bandwidth.
The L3G3200D is available in a plastic land grid array (LGA) package and can operate within a temperature range of -40 °C to +85 °C.
Key Features
| Description | Version | Size |
|---|---|---|
| DS8784: MEMS motion sensor: three-axis digital output gyroscope | 1.0 | 1 MB |
| Description | Version | Size |
|---|---|---|
| TN0018: Surface mounting guidelines for MEMS sensors in an LGA package | 5.0 | 218 KB |
| Description | Version | Size |
|---|---|---|
| MEMS and Sensors, Smart solutions for IoT and enhanced user experience | 1 MB |
| Description | Version | Size |
|---|---|---|
| Optical Image Stabilization (OIS) - white paper | 1.0 | 3 MB |
| 型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| L3G3200DTR | TFLGA 3X3.5X1 16L | Tape And Reel | - | 1000 | NEC | EAR99 | - |
| 型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| L3G3200DTR | TFLGA 3X3.5X1 16L | Industrial | Ecopack2 |
