QFN NiCr Thin Film, Top-Contact Resistor
技术特性
- Wire bondable
- Chip size: 0.020 inches square
- Case: 0202
Datasheet
Packaging Information
- Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family
Product Literature
- Selector Guide - Military and Aerospace Applications
- QFN 61079
- Waffle Pack Packaging 61095
- Selector Guide 60033
- QFN NiCr Thin Film, Top-Contact Resistor 61079
