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CPV363M4UPbF IGBT SIP Module (Ultrafast IGBT)

技术特性

• Fully isolated printed circuit board mount package
• Switching-loss rating includes all “tail” losses
• HEXFRED® soft ultrafast diodes

Datasheet

• CPV363M4UPbF

Application Notes

• Application Note - Mounting Instructions for Single In-Line Package Modules

Package Drawings

• Outline Dimensions - IMS-2 (SIP)

Product Literature

• Selector Guide - Power Modules: Standard Recovery Diode, Fast Recovery Diode, Schottky, Ultrafast, Thyristor, and IGBT

Published Articles

• Article - High Power and Hybrid Vehicles Increase Demand for Load Dump Protection by Soo Man (Sweetman) Kim (Autoelectronics.com, Oct 16 2008)