wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included)

Home > nxp > wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included)

This's latest update document , If this it's wrong , Please report errors to us .

yes