RCP Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate
Features
- Thick film resistive element on an aluminum nitride (AlN) substrates
- Very high thermal conductivity in a small package size
- Termination: tin/lead wraparound termination over nickel barrier. Also available with lead (Pb)-free wraparound terminations.
Datasheet
Lead Free
Product Literature
S-Parameters (*.zip)