QFX Thin Film, Top-Contact Megohm Resistor
Features
- Wire bondable
- Chip size: 0.050 inches square
- Case: 0505
Datasheet
Packaging Information
- Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family
Product Literature
- Selector Guide - Military and Aerospace Applications
- QFX 61031
- Waffle Pack Packaging 61095
- Selector Guide 60033
- QFX Thin Film, Top-Contact Megohm Resistor 61031
