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Si8497DB P-Channel 30 V (D-S) MOSFET

Datasheet

• Si8497DB

General Information

• General Information - Useful Web Links

Markings

• Part Marking Information - MICRO FOOT®

Package Drawings

• Package Information - MICRO FOOT®: 6-Bump (1.5 mm x 1 mm, 0.5 mm Pitch, 0.250 mm Bump Height)

RC Thermal Models

• Si8497DB_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for MICRO FOOT®
• Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result

Tape Info

• Device Orientation-MICRO FOOT® Packages - Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
• Tape Information - MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT

SPICE Models (*.pdf)

• Si8497DB-DS - DS-SPICE Model for Si8497DB

SPICE Models (*.zip)

• Si8497DB-zip - SPICE Models for Si8497DB