• 简体中文
• English

Si8466EDB N-Channel 8 V (D-S) MOSFET

Datasheet

• Si8466EDB

General Information

• General Information - Useful Web Links

Markings

• Part Marking Information - MICRO FOOT®

Package Drawings

• Package Information - MICRO FOOT: 4-Bumps (1 mm x 1 mm, 0.5 mm Pitch, 0.286 mm Bump Height)

RC Thermal Models

• Si8466EDB_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for MICRO FOOT®
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result

Tape Info

• Device Orientation-MICRO FOOT® Packages - Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
• Tape Information - CARRIER TAPE FOR MICRO FOOT® 1 mm x 1 mm DIE SIZE

SPICE Models (*.pdf)

• Si8466EDB-DS - DS-SPICE Model for Si8466EDB

SPICE Models (*.zip)

• Si8466EDB-zip - SPICE Models for Si8466EDB