技术特性

• Package type: surface mount
• Package form: top view
• Dimensions (L x W x H in mm): 5 x 4 x 0.9

数据手册DataSheet 下载

• VEMD5110X01
• TEMD5010X01 - 日本語 - Japanese

Constructions

• Component Construction - Component Construction

Glossary

• Symbols and Terminology - Symbols and Terminology
• Type Designation Code - Type Designation Code

Packaging Information

• Packaging and Order Information - Packaging and Order Information

Product Literature

• Tradeshow Brochure - Infrared Emitters and Photo Detectors

Quality Info

• Assembly Instructions - Assembly Instructions
• Reliability and Statistics Glossary - Reliability and Statistics Glossary

Reference Data

• Physics and Technology - Physics and Technology

Technical Papers

• Measurement Techniques - Measurement Techniques

VEMD5110X01 84204

TEMD5010X01 - 日本語 - Japanese 84679

Component Construction 81579

Symbols IRDC 81288

Type Designation Code 81579

Packaging Information 30205

Tradeshow Brochure 84163

Ordering Information 33008

Reliability and Statistics Glossary 81579

Physics and Technology 81579

Measurement Techniques 81579

VEMD5110X01 Silicon PIN Photodiode 84204