HMC-ALH482-DIE Low Noise Amplifier Chip, 2 - 22 GHz

The HMC-ALH482 is a GaAs MMIC HEMT Low Noise Wideband Amplifier die which operates between 2 and 22 GHz. The amplifier provides 16 dB of gain, 1.7 dB noise figure up to 12 GHz and +14 dBm of output power at 1 dB gain compression while requiring only 45 mA from a +4V supply voltage. The HMC-ALH482 amplifier is ideal for integration into Multi-Chip-Modules (MCMs) due to its small size.

Applications
  • Wideband Communication Systems
  • Surveillance Systems
  • Point-to-Point Radios
  • Point-to-Multi-Point Radios
  • Military & Space
  • Test Instrumentation
Features and Benefits
  • Noise Figure: 1.7 dB @ 2-12 GHz
  • Noise Figure: 2.2 dB @ 12-22 GHz
  • Gain: 16 dB @ 12 GHz
  • P1dB Output Power: +14 dBm
  • Supply Voltage: +4V @ 45 mA
  • Die Size: 2.04 x 1.2 x 0.1 mm
  • Amplifiers
    S-Parameters
    Data Sheets
    Documentnote
    HMC-ALH482 Data SheetPDF 557.46 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    HMC-ALH482 ProductionCHIPS OR DIEOTH 5025C35.6528.88Y
    HMC-ALH482-SX ProductionCHIPS OR DIEOTH 2-55 to 85C00Y
    Reference Materials
    Datasheet
    HMC-ALH482 Data Sheet hmc-alh482-die
    Other
    38, 60 & 82 GHz MMICs for High Capacity Communication Links hmc-sdd112
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    HMC-ALH482 S-Parameter hmc-alh482-die
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e