HMC346 / HMC346C8 / HMC346G8 / HMC346LC3B / HMC346LP3 / HMC346MS8G Voltage Variable Attenuator Chip, SMT, or Hermetic SMT, DC to 8 GHz, 14 GHz, 18 GHz, or 20 GHz

The HMC346 devices are absorptive, voltage variable attenuators (VVAs) operating from dc to 8 GHz, 14 GHz, 18 GHz, or 20 GHz. They feature on-chip reference attenuators for use with an external op-amp to provide simple single voltage attenuation control, 0 V to −3 V. These devices are ideal in designs when an analog dc control signal must control RF signal levels over a 30 dB amplitude range. Applications include AGC circuits and temperature compensation of multiple gain stages in microwave radios and test instrumentation.

Applications
  • Point-to-point radios
  • VSAT radio
  • Base station infrastructure
  • Fiber optics and broadband telecom
  • Microwave radio and VSAT
  • Military radios, radar, and ECM
  • Test instrumentation

Features and Benefits
  • Wide bandwidth: dc to 8 GHz, 14 GHz, 18 GHz, or 20 GHz
  • Low phase shift vs. attenuation
  • 30 dB or 32 dB attenuation range
  • Simplified voltage control
  • Die size: 0.85 × 0.85 × 0.1 mm
  • RoHS compliant, 3 × 3 mm, surface-mount technology (SMT) package
  • 3 × 3 × 1 mm, surface-mount technology (SMT) package
  • Surface-mount, ceramic package
  • 8-lead, hermetic, surface-mount technology (SMT) package
RF & Microwave
HMC346 S-Parameter
Data Sheets
Documentnote
HMC346C8 Data SheetPDF 605 K
HMC346G8 Data SheetPDF 575.27 K
HMC346LC3B Data SheetPDF 655.2 K
HMC346LP3 Data SheetPDF 604.22 K
HMC346MS8G Data SheetPDF 589.22 K
HMC346 Die Data SheetPDF 638.52 K
Application Notes
Documentnote
Designing with the HMC346ms8g Voltage Variable Attenuator Application NotePDF 532.7 K
Order Information
Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
HMC346 Last Time BuyCHIPS OR DIEOTH 5000Y
HMC346C8 Last Time Buy8 ld SMT (4.32x5.59)OTH 5000Y
HMC346C8TR Last Time Buy8 ld SMT (4.32x5.59)REEL 10000Y
HMC346G8 Last Time BuyCERPAK(HERM CER SRF MOUNT)OTH 5000Y
HMC346G8TR Last Time BuyCERPAK(HERM CER SRF MOUNT)REEL 10000Y
HMC346LC3B Last Time Buy12 ld LCC (3x3mm w/1.5mm EP)OTH 5000Y
HMC346LC3BTR Last Time Buy12 ld LCC (3x3mm w/1.5mm EP)REEL 10000Y
HMC346LC3BTR-R5 Last Time Buy12 ld LCC (3x3mm w/1.5mm EP)REEL 50000Y
HMC346LP3 Last Time Buy16 ld QFN (3x3mm w/1.7mm ep)OTH 5000N
HMC346LP3E Last Time Buy16 ld QFN (3x3mm w/1.7mm ep)OTH 5000Y
HMC346LP3ETR Last Time Buy16 ld QFN (3x3mm w/1.7mm ep)REEL 50000Y
HMC346LP3TR Last Time Buy16 ld QFN (3x3mm w/1.7mm ep)REEL 50000N
HMC346MS8G Last Time Buy8 ld MSOP_EPOTH 5000N
HMC346MS8GE Last Time Buy8 ld MSOP_EPOTH 5000Y
HMC346MS8GETR Last Time Buy8 ld MSOP_EPREEL 50000Y
HMC346MS8GTR Last Time Buy8 ld MSOP_EPREEL 50000N
Evaluation Boards
Part NumberDescriptionPriceRoHS
104091-HMC346MS8GEvaluation Board - HMC346MS8G Evaluation PCB-1Y
104095-HMC346G8Evaluation Board - HMC346G8 Evaluation PCB-1Y
105709-HMC346LP3Evaluation Board - HMC346LP3 Evaluation PCB-1Y
109023-HMC346C8Evaluation Board - HMC346C8 Evaluation PCB-1Y
109741-HMC346LC3BEvaluation Board - HMC346LC3B Evaluation PCB-1Y
Reference Materials
HMC346C8 Data Sheet hmc346
HMC346G8 Data Sheet hmc346
HMC346LC3B Data Sheet hmc346
HMC346LP3 Data Sheet hmc346
HMC346MS8G Data Sheet hmc346
HMC346 Die Data Sheet hmc346
HMC346MS8G S-Parameter hmc346
HMC346C8 S-Parameter hmc346
HMC346G8 S-Parameter hmc346
HMC346LC3B S-Parameter hmc346
HMC346LP3 S-Parameter hmc346
Designing with the HMC346ms8g Voltage Variable Attenuator Application Note hmc346
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C,... hmc344
Package/Assembly Qualification Test Report: MS8G (QTR: 2014-00393) hmc536ms8g
Package/Assembly Qualification Test Report: LC3, LC3B, LC3C (QTR: 2014-00376... hmc344
Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR:... hmc344
Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247) hmc344
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR:... hmc344
PCN: MS, QS, SOT, SOIC packages - Sn/Pb plating vendor change hmc536ms8g
HMC Legacy PCN: MS##, MS##E and MS##G,MS##GE packages - Relocation of... hmc536ms8g
8 Lead Ceramic Package Type Specification (C8) hmc347
MSOP 8 & 10 Tape Specification (MS8, MS8G, MS10, MS10G) hmc349ams8g
LP3, LC3, LC3B Tape and Reel Outline Dimensions hmc344