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HLMA-PL00-N0011 Subminiature High Performance AlInGaP LED Lamps

Flat Top PackageThe HLMA-PL00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. For more infor-mation refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.TechnologyThese subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies, the absorbing substrate carrier technology (AS = HLMA-Devices)

Application Brief (5)

• AB I011 Full color LCD backlight LEDs.pdf（10/18/2010）
• AB D-007 - Solutions for common LED design errors in segmented display and multi-indicator applications.pdf（10/18/2010）
• AB I012 Temperature compensation circuit for constant LED intensity.etc（10/18/2010）
• AB A02 Benefits LEDs for instrument cluster light.pdf（10/15/2010）
• AB A04: LED Lamp The Properties.pdf（10/15/2010）

Application Note (3)

• AN 1005 Operational considerations for LED display devices.pdf（07/22/2010）
• AN 1060: Surface Mounting SMT LED Indicator Components.pdf（07/16/2010）
• AN 1100 Selecting LED for automotive interior applications.pdf（07/14/2010）

Data Sheet (2)

• HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00, Subminiature High Performance AlInGaP LED Lamps.pdf（06/01/2011）
• Option 11, 12, 21, 22, 31, 32, 1L, 1S, 2L, 2S, Standard SMT Through Hole Lead Bend Options for Subminiature LED.pdf（09/02/2008）

Product Change Notice (PCN) (4)

• V13-001-48475417-0A.pdf（01/05/2015）
• PCN: V07-006-48475417-0A.pdf（05/30/2007）
• PCN: A04-002-48475417-0A, Aug. 2004.pdf（08/17/2004）
• Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002.pdf（09/02/2002）

Reliability Data Sheet (1)

• HLMT-Px00 Qx00 High PerA1lnGap.pdf（05/28/2006）