HLMA-PL00-QRR11 Subminiature LED Lamps

Flat Top Package The HLMX-PXXX flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Dome Packages The HLMX-QXXX dome lamps use an untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern. Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Zbend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for subminiature LED Lamps data sheet. Technology These subminiature solid state lamps utilize one of the two newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies, either the absorbing substrate carrier technology (AS = HLMADevices) or the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions. The colors 590 nm amber, 605 nm orange, 615 nm reddish-orange, 626 nm red, and 635 nm red are available with viewing angles of 15° for the domed devices and 125° for the flat top devices.

Features
  • Subminiature Flat Top Package Ideal for Backlighting and Light Piping Applications
  • Subminiature dome package Nondiffused dome for high brightness
  • Wide range of drive currents
  • Colors: 590 nm Amber, 605 nm Orange, 615 nm Reddish-Orange, 626 nm Red, and 635 nm Red
  • Ideal for Space Limited Applications
  • Axial Leads
  • Available with Lead Configurations for Surface Mount and Through Hole PC Board Mounting
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Samples AvailableYes
ColorAmber
Color Bin Selection2
Dimension Lxwxh In Mm2.2 x 2.1 x 2.2
Intensity Bin Selection2
Lead Bend ConfigurationGull Wing
RoHS6 CompliantY
Led Chip TypeAS-AlInGaP
Max Qty of Samples10
Minimum Luminous Intensity (mcd)200.0
Peak Output Current Min Uom2a
Mounting DirectionReverse
Mounting MethodSurface Mount
Number Of ColorsSingle
PackageFlat Top Subminiature
Test Current (mA)20.0
Typical Forward Voltage In V1.9
Typical Dominant Wavelength (nm)590
Typical Luminous Intensity (mcd)N/A
Viewing Angle (degree)125°
Application Note (1)
Data Sheet (1)
Product Change Notice (PCN) (3)