HSMP-389T PIN switch diode _ BDTIC a Leading Distributor in China

HSMP-389T PIN switch diode

The HSMP-389T pin diodes have been optimized for switching applications where low resistance at low bias current and low capacitance are required.

Features

Ct=0.3pF
Rs@5mA=2.5ohms
Tau=200nsec

Specification	Value
Lifecycle	Active
Samples Available	No
Bkdwn Vo In V	35.0
Carrier Life In Nsec (ns)	200
Connection	Low Inductance Single
RoHS6 Compliant	Y
Max Cap In Pf	0.3
Distrib. Inventory	Yes
Max Qty of Samples	0
Peak Output Current Min Uom	MSL 1
Mounting Direction	Top
Mounting Method	Solder Reflow
Pin Count	6.0
Product Type	Low Resistance Switch
Lifetime Ns	200.0
Ct (pF)	0.2
RS (ohm)	2.5
VBR (V)	100
Vbr V	100.0
Ct Pf	0.2
Series Res In Ohms	2.5
Configuration	Low Inductance
Package	SOT-363

Application Brief (1)

Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (11)

AN 9571: Broading the Shunt PIN Diode SPDT Switch.pdf（08/16/2010）
AN 9572: Reducing the Insertion Loss a Shunt PIN Diode.pdf（08/14/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1049: A Distortion PIN Diode Switch Surface Mount Devices.pdf（08/13/2010）
AN 1072: Applications for the HSMP3890 Surface Mount Switching PIN Diode.pdf（08/13/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 1048: Cost Surface Mount PIN Diode Pi Attenuator.pdf（07/13/2010）
AN 922: Applications PIN Diodes.pdf（07/13/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）

Data Sheet (1)

HSMP-389x, HSMP-489x, Surface Mount RF PIN Switch Diodes.pdf（07/23/2015）

Product Change Notice (PCN) (16)

V11-024-480035-0B - Assembly and Test related change.pdf（05/15/2012）
V11-024-480035-0A - Assembly and Test related change.pdf（11/04/2011）
Qualifying New Contract Manufacturers.pdf（03/02/2009）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A05-010-480035-0A, Mar. 2005.pdf（03/18/2005）
PCN: A04-001-480035-0A, Mar. 2004.pdf（03/23/2004）
PCN: A03-003-480035-1A, Sept. 2003.pdf（09/30/2003）
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002.pdf（09/02/2002）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）
Recall Notification for SOT-323 (SC-70 3-Lead).pdf（04/25/2001）
022500TC1: Customer Change Notification.pdf（06/01/2000）
CCN:112999tc1 - HSMP-389x and 489x back metal change.pdf（11/29/1999）
CCN#9904A-REVISION B: Customer Change Notice.pdf（08/01/1999）
CCN:9710a - HSMS, HSMP #L30, #L31.pdf（10/10/1997）
CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change.pdf（06/25/1997）

Reliability Data Sheet (1)

HSMP-38xx HSMP-48xx Surface Mount PIN Diodes.pdf（06/22/2012）

Spice Model (1)

HSMP-389x_APLAC.etc（02/26/2000）

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