HSMS-280L Low reverse leakage Schottky diode _ BDTIC a Leading Distributor in China

HSMS-280L Low reverse leakage Schottky diode

Features

General purpose Schottky diode in a broad range of package configurations. Optimised for High voltage clamp or analog DC switch applications. For low breakdown applciations, like detectors or mixers, please refer to HSMS-282X. For low flicker (1/F) noise applications refer to HSMS-281X. VBR=70 V, CT=2.0pF, RD=35 Ohms, Vf @ 1 mA=410 mV.

Specification	Value
Lifecycle	Active
Distrib. Inventory	Yes
Samples Available	No
Configuration	Unconnected Trio
Ct Pf	2.0
RoHS6 Compliant	Y
Max Qty of Samples	0
Package	SOT-363 (SC-70 6 Lead)
Vbr V	70.0
Vf Mv	400.0
Series Res In Ohms	35.0

Application Brief (1)

Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (16)

AN 956-5: Dynamic Range Extension Schottky Detectors.pdf（08/16/2010）
AN 988: All Schottky Diodes are Zero Bias Detectors.pdf（08/14/2010）
AN 986: Square Law Linear Detection.pdf（08/14/2010）
AN 963: Matching Techniques for Mixers Detectors.pdf（08/14/2010）
AN 987: Is Bias Current Necessary.pdf（08/14/2010）
AN 1088: Designing the Virtual Battery.pdf（07/22/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN 9561: The Criterion for the Tangential Sensitivity Measurement.pdf（07/19/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 956-3 Flicker Noise Schottky Diodes.pdf（07/13/2010）
AN 956-6: Temperature Dependence Schottky Detector Voltage Sensitivity.pdf（06/28/2010）
AN 1069: Non RF Applications for the Surface Mount Schottky Diode Pairs HSMS2802 HSMS2822.pdf（06/16/2010）
AN 9441: Microwave Transistor Bias Considerations.pdf（05/11/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）
AN 1156: Diode Detector Simulation EEs ADS Softward.pdf（02/22/2007）
AN 923: Schottky Barrier Video Detectors.pdf（12/09/2006）

Data Sheet (1)

HSMS-280x, Surface Mount RF Schottky Barrier Diodes.pdf（04/15/2010）

Product Change Notice (PCN) (18)

V11-024-480035-0B - Assembly and Test related change.pdf（05/15/2012）
V11-024-480035-0A - Assembly and Test related change.pdf（11/04/2011）
Qualifying New Contract Manufacturers.pdf（03/02/2009）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A05-010-480035-0A, Mar. 2005.pdf（03/18/2005）
PCN: A04-001-480035-0A, Mar. 2004.pdf（03/23/2004）
PCN: A03-003-480035-1A, Sept. 2003.pdf（09/30/2003）
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002.pdf（09/02/2002）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）
Recall Notification for SOT-323 (SC-70 3-Lead).pdf（04/25/2001）
022500TC1: Customer Change Notification.pdf（06/01/2000）
CCN#9904A-REVISION B: Customer Change Notice.pdf（08/01/1999）
CCN:9905a - HSMS-280x and -281x subcon.pdf（05/01/1999）
CCN:9811a - HSMS, HBAT laser marking.pdf（11/01/1998）
CCN:9710a - HSMS, HSMP #L30, #L31.pdf（10/10/1997）
CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change.pdf（06/25/1997）
CCN:22195 - Manufacturing Wafer Fab Relocation.pdf（02/21/1995）

Reliability Data Sheet (1)

HBAT-54xx, HSMS-270x, HSMS-280x, HSMS-281x, HSMS-282x, Surface Mount Schottky Diodes Reliability Data Sheet.pdf（08/02/2007）

Spice Model (1)

HSMS-280x_SPICE.etc（02/26/2000）

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