FPF2C8P2NL07A: F2, 3-phase, 3-level NPC module with Press-fit / NTC _ BDTIC a Leading Distributor in China

FPF2C8P2NL07A: F2, 3-phase, 3-level NPC module with Press-fit / NTC

Fairchild's new inverter modules provide low conduction and switching loss as well. And Press-Fit technology provides simple and reliable mounting. These modules are optimized for the applications such as solar inverter and UPS where a high efficiency and robust design is needed.

FPF2C8P2NL07A Datasheet

Features

High Efficiency
Low Conduction and Switching Losses
Field Stop IGBT for Inner and Outer Switch
STEALTH^TMDiode for Path Diode
Built-in NTC for Temperature Monitoring

**Ordering Code**
Product	Product & Eco Status	Unit Price/1K Order	Packing Method Convention	Package Marking Convention*
FPF2C8P2NL07A	Full Production ROHS Compliant as of 27-Feb-2006 China RoHS	$79.002	HPM F2 34L Pressfit Terminal - 16.4 x 62.8 x 56.7mm, TRAY HPM F2 34L Pressfit Terminal Drawing Last Update: Apr 2015 Tray Packing dwg template Last Update: Jun 2015	Line 1$Y (Fairchild logo) &Z (Plant Code) &3 (3-Digit Date Code) &K Line 2FPF2C8P2TL07A Line 30000

Application Notes

AN-558 Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016

AN-9052 Design Guide for Selection of Bootstrap Components Last Update : 28-Jun-2011

AN-6069 Application Review and Comparative Evaluation of Low-Side Gate Driver Last Update : 09-Dec-2013

AN-8102 Recommendations to Avoid Short Pulse Width Issues in HVIC Gate Driver Applications Last Update : 01-May-2015

AN-6076 Design and Application Guide of Bootstrap Circuit for High-Voltage Gate-Drive IC Last Update : 19-Dec-2014

AN-5232 New Generation Super-Junction MOSFETs, SuperFET® II and SuperFET® II Easy Drive MOSFETs for High Efficiency and Lower Switching Noise Last Update : 28-Jun-2014

AN-1031 Considerations in Designing the Printed Circuit Boards of Embedded Switching Power Supplies Last Update : 05-Mar-2011

AN-7017 Reducing Power Losses in MOSFETs by Controlling Gate Parameters Last Update : 05-Mar-2011

AN-4167 Mounting Guideline for F1 / F2 Modules with Press-Fit Pins Last Update : 11-Nov-2015

AN-5077 Design Considerations for High Power Module (HPM) Last Update : 04-Dec-2014

FPF2C8P2NL07A.pdf

Application Review and Comparative Evaluation of Low-Side Gate Driver Last Update : 09-Dec-2013

Recommendations to Avoid Short Pulse Width Issues in HVIC Gate Driver Applications Last Update : 01-May-2015

Design and Application Guide of Bootstrap Circuit for High-Voltage Gate-Drive IC Last Update : 19-Dec-2014

New Generation Super-Junction MOSFETs, SuperFET® II and SuperFET® II Easy Drive MOSFETs for High Efficiency and Lower Switching Noise Last Update : 28-Jun-2014

HPM F2 34L Pressfit Terminal Drawing Last Update: Apr 2015

Tray Packing dwg template Last Update: Jun 2015

Introduction to Power MOSFETs and their Applications Last Update : 29-Mar-2016

Design Guide for Selection of Bootstrap Components Last Update : 28-Jun-2011

Considerations in Designing the Printed Circuit Boards of Embedded Switching Power Supplies Last Update : 05-Mar-2011

Design Considerations for High Power Module (HPM) Last Update : 04-Dec-2014

Reducing Power Losses in MOSFETs by Controlling Gate Parameters Last Update : 05-Mar-2011

Mounting Guideline for F1 / F2 Modules with Press-Fit Pins Last Update : 11-Nov-2015

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