Summary of Features:

• ESD / Transient protection of high speed data lines exceeding: IEC61000-4-2 (ESD): ±16 kV (air contact) IEC61000-4-5 (surge): ±3 A (8/20 μs)
• IEC61000-4-2 (ESD): ±16 kV (air contact)
• IEC61000-4-5 (surge): ±3 A (8/20 μs)
• Supports applications with signal voltage between -5.5 V and 5.5 V max.
• Low dynamic resistance: RDYN ≤ 0.2 Ω typ and low clamping voltage (see data sheet).
• Very low reverse current: I R = 0.1nA typ.
• Line capacitance: CL = 6.5 pF
• Minimized overshoot due to extremely low parasitic inductance of chip scale package.
• Miniature form factor (XY) = 0201 (0.58 mm x 0.28 mm)
• Thin 0.15 mm package thickness to allow direct integration into modules
• Optimized assembly: its bidirectional and symmetric I/V characteristics allow
• placement on the PCB with no danger of polarity orientation issues.

Target Applications:

• ESD Protection of highly susceptible IC/ASICs in audio, headset, human digital interfaces.
• Dedicated solution to boost space saving and high performance in miniaturized modern electronics.