EconoPACK™ 4 650V three phase chopper IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and NTC
Title | Size | Date | Version |
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FD300R07PE4_B6 (german/english),EN/DE,EN/CN,EN/JA | 832 KB | 08 Mar 2013 | 02_02 |
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Best-in-class products to meet your application demands;EN | 1.3 MB | 27 Apr 2016 | 08_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 May 2016 | 01_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 Apr 2016 | 03_00 |
Title | Size | Date | Version |
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Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 Dec 2015 | 01_02 |
Driving IGBTs with unipolar gate voltage;EN;CN | 389 KB | 10 Feb 2014 | |
Soldering of Econo and Easy Modules;EN | 194 KB | 10 Feb 2014 | |
Assembly Instructions EconoPACK™4 Modules;EN;DE;CN | 950 KB | 01 Feb 2013 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 Apr 2009 | |
Using the NTC inside a power module;EN;CN | 295 KB | 13 Jan 2010 | |
模块的评估驱动板;CN | 2.3 MB | 25 Nov 2013 | |
Thermal equivalent circuit models (english version);EN;DE;CN | 295 KB | 20 Jun 2008 | |
Deadtime calculation for IGBT Modules;EN;CN | 308 KB | 06 Jun 2008 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 Feb 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 Feb 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 Feb 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 Feb 2014 |
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EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules;EN | 440 KB | 27 Apr 2016 | 07_00 |
PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 Apr 2016 | 08_00 |
EconoPACK™4 Power Modules;EN | 106 KB | 27 Apr 2016 | 07_00 |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 Nov 2015 | 01_00 |
IGBT Module technology state of the art and future evolutions;EN | 37 KB | 07 Feb 2014 | |
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time;EN | 191 KB | 31 Jan 2011 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 May 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 May 2014 |
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Solutions for Industrial Drives;EN | 2.4 MB | 27 Apr 2016 | 09_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 Apr 2016 | 08_00 |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 May 2016 | 01_00 |
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MCDS - EconoPACK4;EN | 58 KB | 06 Jan 2014 | 03_00 |
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IPOSIM;EN | 3.4 MB | 18 Mar 2014 |
Title | Size | Date | Version |
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FD300R07PE4_B6 | EconoPACK™4 module | AG-ECONO4-1-1;EN | 522 KB | 11 Apr 2016 | 01_00 |