FS215R04A1E3D

HybridPACK™ 1 with the ultra thin wafer 400Vces chipset is an automotive qualified power module designed for Hybrid Electric Vehicle (HEV) applications. The chipset is optimized for working voltages of 100V to about 250V and has lowest conduction and switching losses. It reduces the chip power losses up to 25% compared to the same chip size with latest 650Vces IGBT technology.

ParametricFS215R04A1E3D
VCES / VRRM400.0V
ConfigurationSixpack
IC(nom) / IF(nom)215.0A
TechnologyIGBT3 - E3
VCE(sat) (Tvj=25°C typ)1.3V
HousingHybridPACK™1
VF (Tvj=25°C typ)1.35V
Sales Product NameFS215R04A1E3D
OPNFS215R04A1E3DBOMA1
Product Statusactive and preferred
Package NameAG-HYBRID1-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size16
Packing TypeTRAY
Summary of Features:
  • Complete 3-phase Six-Pack with NTC in one compact module
  • High efficient 400Vces Ultra Thin Wafer Trench-Field-Stop IGBT3 with matching 400V Emitter Controlled 3 diode.
  • Increased diode current capability optimized for generator mode in hybrid electric vehicles
  • 25% reduced gate charge compared to IGBT3 650V reduces gate driver power losses
  • Enhanced wire bonding
  • Rugged Al (2)O (3) ceramic for automotive applications with high thermal cycle requirements
  • Copper base plate for optimized cooling
Benefits:
  • High efficient system approach for DCL voltages up to 200V
  • High reliability
  • Same mounting as HybridPACK1 modules with 650V chipset (modular approach)
Benefits:
  • High efficient system approach for DCL voltages up to 200V
  • High reliability
  • Same mounting as HybridPACK1 modules with 650V chipset (modular approach)
Diagrams
Data Sheet
TitleSizeDateVersion
FS215R04A1E3D (german/english),EN594 KB24 Jul 201403_00
FS215R04A1E3D (japanese/english)835 KB24 Jul 201403_00
FS215R04A1E3D (chinese/english),EN845 KB24 Jul 201403_00
Product Brochure
TitleSizeDateVersion
Hybrid Electric & Electric Cars；EN5 MB20 May 2014
Application Notes
TitleSizeDateVersion
Automotive IGBT Module - Explanation of Technical Information；EN1.8 MB18 Nov 2010
Driving IGBTs with unipolar gate voltage；EN；CN389 KB10 Feb 2014
General Information & Mounting Instructions for HybridPACK™1；EN895 KB25 Aug 2010
Thermal equivalent circuit models (english version)；EN；DE；CN295 KB20 Jun 2008
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 Feb 2014
Paralleling of IGBTs；EN28 KB10 Feb 2014
Hybrid Kit - Evaluation Kit for Applications with HybridPACK™1 Modules；EN4.7 MB05 Apr 2012
Editorials
TitleSizeDateVersion
Reliability of Power Modules in Hybrid Vehicles；EN366 KB31 Jan 2011
Higher Junction Temperature in Power Modules；EN1.3 MB06 Jun 2008
Application Brochure
TitleSizeDateVersion
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 Jul 2014
Evaluation Boards
BoardFamilyDescriptionStatus
HYBRID KIT1+IGBT ModulesEvaluation Kit including HybridPACK™ 1 power module, driverboard with coreless transformer isolated driver (1ED020I12- FA) and logic boardCAN Transceiver TLE6250DC/DC Converter TLE8366EV, TLE7368Diodes: BAS16, BAT54-04WDriver IC 1ED020I12FA2Including: IGBT Module FS400R07A1E3MOSFETs: IPD90P03P4L-04, IPD144N06NG, BSS138NMicrocontroller SAK-TC1767-256F133HLTransitor: BCR183S, BCR10PN, BDP949Voltage Regulator TLE4266, TLE4296-2GV50on request
Development Tools
TitleSizeDateVersion
AppNote HP2 Inverter TC1767 Installer - LogicBoard v1.3B4.1 MB03 Feb 201102_10
Motor Control Graphical User Interface (GUI) version 201003 for HybridKits1.4 MB30 Mar 2010
AppNote HP1Inverter-TC1766_Installer - Adapterboard+Triboard2.7 MB22 Sep 200901_00
AAppNote HP1Inverter-TC1797_Installer - Adapterboard+Triboard2.7 MB22 Sep 200901_01
EN FS215R04A1E3D
EN FS215R04A1E3D
FS215R04A1E3D (japanese/english) FS215R04A1E3D
EN eicedriver-tm-automotive-qualified
EN 2ED020I12FA
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS200R07A1E3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN HYBRID+KIT1+PIN-FIN
EN FS200R07A1E3
EN FS200R07A1E3
EN XMC4500-E144X1024+AC
AppNote HP2 Inverter TC1767 Installer - LogicBoard v1.3B HYBRID+KIT1+PIN-FIN
Motor Control Graphical User Interface (GUI) version 201003 for HybridKits HYBRID+KIT1+PIN-FIN
AppNote HP1Inverter-TC1766_Installer - Adapterboard+Triboard FS200R07A1E3
AAppNote HP1Inverter-TC1797_Installer - Adapterboard+Triboard FS200R07A1E3
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