P-M4.8

Contact-based module 8 contacts Epoxy Tape Wire Bond Mold

ParametricP-M4.8
Product DescriptionContact-based module, 8 Contacts, Epoxy Tape, Wire Bond, Mold
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 600μm
Contact SurfaceCIN
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
DerivativesAu surface, Pd surface
Delivery FormsTape on Reel
ApplicationsPayment, Government Identification
Product NameP-M4.8
Summary of Features:
  • 14.25mm
  • 13 x 11.8mm
  • max. 600?m
  • CIN
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface
  • Tape on Reel
Target Applications:
  • Payment,
  • Government,
  • Healthcare,
  • Identification
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 Feb 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 Nov 201511_15
EN S-COM86
EN S-COM86