数据手册:MAX710, MAX711 紧凑的低噪声、无变压器升/降压调节器,仅使用一只电感,具有低输出纹波 .pdf [英文Rev.0(PDF,152kB)]
{状况:生产中。}
The MAX710/MAX711 integrate a step-up DC-DC converter with a linear regulator to provide step-up/down voltage conversion. They are optimized for battery applications where the input varies above and below the regulated output voltage. They have an input range from +1.8V to +11V. Typical efficiency when boosting battery inputs is 85%.
The MAX710/MAX711 can be configured for minimum noise or optimum efficiency. Shutdown control turns off the part completely, disconnecting the input from the output (ISHDN = 0.2µA). Standby control turns off only the step-up converter and leaves the low-power linear regulator active (IQ = 7µA).
The MAX710 has a preset 3.3V or 5V output voltage. The MAX711 has an adjustable output that can be set from +2.7V to +5.5V with two resistors. Both devices come in 16-pin narrow SO packages.
产品关键特性
- Step-Up/Down Voltage Conversion
- +1.8V to +11V Input Range
- Output:
- 5V/250mA at VIN = 1.8V
- 5V/500mA at VIN = 3.6V
- No External FETs Required
- Load Disconnected from Input in Shutdown
- Battery Drain:
- 200µA No-Load (VIN = 4V)
- 7µA in Standby
- 0.2µA when Off
- Low-Noise and High-Efficiency Modes
| 应用与使用范围
- 2节至4节AA碱性电池供电的手持设备
- 2节、3节及4节电池供电设备
- 3.3V及其它低电压系统
- 电池供电设备与AC输入适配器
- 数码相机
- 单节锂离子电池供电便携式设备
|
典型工作电路
芯片订购型号
订购型号 | 产品状态 | 封装形式 | 工作温度 | RoHS/无铅 |
MAX710C/D | 生产中 | DICESALES;NA引脚;DICE;封装信息 | | 参考数据资料 |
MAX710ESE | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:否材料分析 |
MAX710ESE+ | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:无铅材料分析 |
MAX710ESE+T | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:无铅材料分析 |
MAX710ESE-T | 生产中 | N.SO;16引脚封装信息 | -40°C至+85°C | 参考数据资料 |
MAX711C/D | 生产中 | DICESALES;NA引脚;DICE;封装信息 | | 参考数据资料 |
MAX711ESE | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:否材料分析 |
MAX711ESE+ | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:无铅材料分析 |
MAX711ESE+T | 生产中 | SOIC(N);16引脚;61.9mm²封装信息 | -40°C至+85°C | RoHS/无铅:无铅材料分析 |
MAX711ESE-T | 生产中 | N.SO;16引脚封装信息 | -40°C至+85°C | 参考数据资料 |
功能接近器件
评估板与开发套件
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