An epitaxial Schottky barrier diode encapsulated in a SOD882 leadless ultra small plastic package.
ESD sensitive device, observe handling precautions.
Name/Description | Modified Date |
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Schottky barrier diode (REV 1.0) PDF (93.0 kB) 1PS10SB82 | 20 Aug 2003 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
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1PS10SB82 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS10SB82_1 | 31 Jan 2015 |
1PS10SB82 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS10SB82_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
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1PS10SB82 | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 0.2@VR=1V | single | 340@IF=1mA | 1@VR=0V | 15 | 30 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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1PS10SB82 | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 1PS10SB82,315 (9340 572 50315) | S5 | 1PS10SB82 | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |