2PA1774xMB series: 40 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
-
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 40 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (327.0 kB) 2PA1774XMB_SER [English] | 26 Mar 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English] | 22 Jul 2016 |
Reliability and Quality Information (6)
| Name/Description | Modified Date |
|---|---|
| 2PA1774QMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774QMB [English] | 31 Jan 2015 |
| 2PA1774QMB NXP Product Quality (REV 1.3) PDF (74.0 kB) 2PA1774QMB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774RMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774RMB [English] | 31 Jan 2015 |
| 2PA1774RMB NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774RMB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774SMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SMB [English] | 31 Jan 2015 |
| 2PA1774SMB NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SMB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- 2PA1774QMB SPICE model (REV 1.4) prm 2PA1774QMB_1 7/22/2012
- 2PA1774RMB SPICE model (REV 1.4) prm 2PA1774RMB_1 7/22/2012
- 2PA1774SMB SPICE model (REV 1.4) prm 2PA1774SMB_1 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| 2PA1774SMB | Active |
| 2PA1774RMB | Active |
| 2PA1774QMB | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774QMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774QMB,315 (9340 658 94315) | 0100 0000 | 2PA1774QMB |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774RMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774RMB,315 (9340 658 95315) | 0000 1101 | 2PA1774RMB | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774SMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774SMB,315 (9340 658 96315) | 0000 1110 | 2PA1774SMB | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 40 V, 100 mA PNP general-purpose transistors 2PA1774XMB_SERIES
- 2PA1774QMB NXP® Product Reliability 2PA1774XMB_SERIES
- 2PA1774QMB NXP Product Quality 2PA1774XMB_SERIES
- 2PA1774RMB NXP® Product Reliability 2PA1774XMB_SERIES
- 2PA1774RMB NXP Product Quality 2PA1774XMB_SERIES
- 2PA1774SMB NXP® Product Reliability 2PA1774XMB_SERIES
- 2PA1774SMB NXP Product Quality 2PA1774XMB_SERIES
- 2PA1774QMB SPICE model 2PA1774XMB_SERIES
- 2PA1774RMB SPICE model 2PA1774XMB_SERIES
- 2PA1774SMB SPICE model 2PA1774XMB_SERIES
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
- PMZB950UPE
