74HC137DB: 3-to-8 line decoder, demultiplexer with address latches; inverting
The 74HC137 is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). The 74HC137 is specified in compliance with JEDEC standard no. 7A.
The 74HC137 is a 3-to-8 line decoder, demultiplexer with latches at the three address inputs (An). The 74HC137 essentially combines the 3-to-8 decoder function with a 3-bit storage latch. When the latch is enabled (LE = LOW), the 74HC137 acts as a 3-to-8 active LOW decoder. When the latch enable (LE) goes from LOW-to-HIGH, the last data present at the inputs before this transition, is stored in the latches. Further address changes are ignored as long as LE remains HIGH.
The output enable input (E1 and E2) controls the state of the outputs independent of the address inputs or latch operation. All outputs are HIGH unless E1 is LOW and E2 is HIGH.
The 74HC137 is ideally suited for implementing non-overlapping decoders in 3-state systems and strobed (stored address) applications in bus oriented systems.
Outline 3d SOT338-1
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 3-to-8 line decoder, demultiplexer with address latches; inverting (REV 4.0) PDF (168.0 kB) 74HC137 [English] | 23 Dec 2015 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English] | 13 Mar 2013 |
| Pin FMEA 74HC/74HCT family (REV 1.0) PDF (51.0 kB) AN11044 [English] | 16 Mar 2011 |
Users Guides (1)
| Name/Description | Modified Date |
|---|---|
| HC/T User Guide (REV 1.0) PDF (508.0 kB) HCT_USER_GUIDE [English] | 01 Nov 1997 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic shrink small outline package; 16 leads; body width 5.3 mm (REV 1.0) PDF (306.0 kB) SOT338-1 [English] | 08 Feb 2016 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Footprint for reflow soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-REFLOW [English] | 08 Oct 2009 |
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
Ordering Information
| Product | Status | Family | Function | VCC (V) | Description | Logic switching levels | Package version | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | No of pins |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC137DB | Active | HC(T) | Decoders/demultiplexers | 2.0 - 6.0 | inverting | CMOS | SOT338-1 | +/- 5.2 | 18 | low | -40~125 | 148 | 42.0 | SSOP16 | 16 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC137DB | | SOT338-1 | SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74HC137DB,118 (9351 896 60118) | HC137 | 74HC137DB |    | week 12, 2005 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
| Bulk Pack | Active | 74HC137DB,112 (9351 896 60112) | HC137 | 74HC137DB | | week 12, 2005 | 84.9 | 6.62 | 1.51E8 | 1 | 1 |
- Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
- Pin FMEA 74HC/74HCT family 74HC_T_597_Q100
- HC/T User Guide 74HCU04PW
- plastic shrink small outline package; 16 leads; body width 5.3 mm 74HC_T_595_Q100
- Footprint for reflow soldering 74HC_T_595_Q100
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- HEF4094B
