The 74LVC1GX04 combines the functions of the 74LVC1GU04 and 74LVC1G04 to provide a device optimized for use in crystal oscillator applications.
The integration of the two devices into the 74LVC1GX04 produces the benefits of a compact footprint. It provides lower power dissipation and stable operation over a wide frequency and temperature range.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Name/Description | Modified Date |
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X-tal driver (REV 3.0) PDF (115.0 kB) 74LVC1GX04 [English] | 21 Aug 2013 |
Name/Description | Modified Date |
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Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English] | 30 Dec 2010 |
PicoGate Logic footprints (REV 1.0) PDF (87.0 kB) AN10161 [English] | 30 Oct 2002 |
Name/Description | Modified Date |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
Product | Status | Family | Type | Description | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | No of bits | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | No of pins | Package name | Package version |
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74LVC1GX04GW | Active | LVC | Combination gates | crystal driver | 1.65 - 5.5 | CMOS / LVTTL | +/- 24 | 2.8 | 150 | 1 | low | -40~125 | 264 | 38.4 | 153 | 6 | TSSOP6 | SOT363 |
74LVC1GX04GV | Active | LVC | Combination gates | crystal driver | 1.65 - 5.5 | CMOS / LVTTL | +/- 24 | 2.8 | 150 | 1 | low | -40~125 | 232 | 39.4 | 145 | 6 | TSOP6 | SOT457 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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74LVC1GX04GW | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74LVC1GX04GW,125 (9352 740 24125) | VX | 74LVC1GX04GW | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||
74LVC1GX04GV | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74LVC1GX04GV,125 (9352 740 25125) | VX4 | 74LVC1GX04GV | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 |