74LVC574A: Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) (Based on PIP 74LVC574A)
The 74LVC574A is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus-oriented applications. A clock (CP) and an Output Enable (OE) input are common to all flip-flops.
The eight flip-flops will store the state of their individual D-inputs that meet the set-up and hold times requirements on the LOW to HIGH CP transition.
When OE is LOW, the contents of the eight flip-flops are available at the outputs. When OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops.
Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be applied to the outputs. These features allow the use of these devices as translators in mixed 3.3 V or 5 V applications.
The 74LVC574A is functionally identical to the 74LVC374A, but has a different pin arrangement.
74LVC574A: Product Block Diagram
Outline 3d SOT339-1
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state (REV 5.0) PDF (137.0 kB) 74LVC574A [English] | 18 Dec 2012 |
Application Notes (5)
| Name/Description | Modified Date |
|---|---|
| Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
| Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
| Pin FMEA for LVC family (REV 1.0) PDF (44.0 kB) AN11009 [English] | 04 Feb 2011 |
| Power considerations when using CMOS and BiCMOS logic devices (REV 1.0) PDF (100.0 kB) AN263 [English] | 05 Feb 2002 |
| Interfacing 3 Volt and 5 Volt Applications (REV 1.0) PDF (63.0 kB) AN240 [English] | 15 Sep 1995 |
Selector Guides (2)
| Name/Description | Modified Date |
|---|---|
| ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English] | 19 Nov 2015 |
| Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English] | 08 Jan 2015 |
Package Information (4)
| Name/Description | Modified Date |
|---|---|
| plastic small outline package; 20 leads; body width 7.5 mm (REV 1.0) PDF (335.0 kB) SOT163-1 [English] | 08 Feb 2016 |
| plastic shrink small outline package; 20 leads; body width 5.3 mm (REV 1.0) PDF (325.0 kB) SOT339-1 [English] | 08 Feb 2016 |
| plastic thin shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0) PDF (304.0 kB) SOT360-1 [English] | 08 Feb 2016 |
| plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x... (REV 1.0) PDF (190.0 kB) SOT764-1 [English] | 08 Feb 2016 |
Packing (4)
| Name/Description | Modified Date |
|---|---|
| SSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code... (REV 1.0) PDF (204.0 kB) SOT339-1_118 [English] | 02 Oct 2015 |
| DHVQFN20; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or... (REV 4.0) PDF (203.0 kB) SOT764-1_115 [English] | 23 Apr 2013 |
| SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (246.0 kB) SOT163-1_118 [English] | 15 Apr 2013 |
| TSSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (225.0 kB) SOT360-1_118 [English] | 15 Apr 2013 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
IBIS Model
- lvc574a IBIS model (REV 1.0) ibs LVC574A 4/7/2013
SPICE model
- lvc Spice model (REV 1.0) ZIP LVC 5/7/2013
Ordering Information
| Product | Status |
|---|---|
| 74LVC574ADB | Active |
| 74LVC574AD | Active |
| 74LVC574APW | Active |
| 74LVC574ABQ | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC574APW |  | SOT360-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74LVC574APW,118 (9352 190 50118) | LVC574A | 74LVC574APW |    | week 7, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
| Bulk Pack | Active | 74LVC574APW,112 (9352 190 50112) | LVC574A | 74LVC574APW | | week 7, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||||
| 74LVC574ABQ |  | SOT764-1 | Reel 7" Q1/T1 | Active | 74LVC574ABQ,115 (9352 735 17115) | LVC574A | 74LVC574ABQ | | Always Pb-free | 123.8 | 3.87 | 2.58E8 | 1 | 1 | |
| 74LVC574AD |  | SOT163-1 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q1/T1 | Active | 74LVC574AD,118 (9352 190 30118) | 74LVC574AD | 74LVC574AD |  | week 30, 2004 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
| Bulk Pack | Active | 74LVC574AD,112 (9352 190 30112) | 74LVC574AD | 74LVC574AD | | week 30, 2004 | 123.8 | 3.87 | 2.58E8 | 1 | 1 | ||||
| 74LVC574ADB | | SOT339-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | 74LVC574ADB,118 (9352 190 40118) | LVC574A | 74LVC574ADB | | week 17, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
| Bulk Pack | Active | 74LVC574ADB,112 (9352 190 40112) | LVC574A | 74LVC574ADB | | week 17, 2005 | 123.8 | 3.87 | 2.58E8 | 1 | 1 |
- 74LVC574A
- Interfacing 3 Volt and 5 Volt Applications 74LVC377PW
- Power considerations when using CMOS and BiCMOS logic devices 74AHCT244PW
- Pin FMEA for LVC family 74LVC1G123_Q100
- Sorting through the low voltage logic maze 74LVC_H_245A_Q100
- Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
- Low voltage CMOS family - LVC 74LVC_H_245A_Q100
- Footprint for reflow soldering SOT339-1 74LVT640
- plastic shrink small outline package; 20 leads; body width 5.3 mm 74LVT640
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- SO20; Reel dry pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,518 or... NPIC6C4894_Q100
- plastic small outline package; 20 leads; body width 7.5 mm SA615
- Reel 13" Q1/T1 LPC812M101JD20
- Tape reel SMD; standard product orientation 12NC ending 115 buk1m200-50sgtd
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- plastic thin shrink small outline package; 20 leads; body width 4.4 mm PCA9634
- Reel 13" Q1/T1 LPC824M201JDH20
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm 74VHC_T_245
- Footprint for reflow soldering SOT764-1 74VHC_T_245
- DHVQFN20; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or... 74LVC_H_245A_Q100
- lvc574a IBIS model 74LVC574A
- lvc Spice model 74LVC3G17GT
