The 74LVTN16245B is a high-performance BiCMOS product designed for VCC operation at 3.3 V.
This device is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The control function implementation minimizes external timing requirements. The device features an output enable input (nOE) for easy cascading and a direction input (nDIR) for direction control.
Name/Description | Modified Date |
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3.3 V 16-bit transceiver; 3-state (REV 5.0) PDF (216.0 kB) 74LVTN16245B [English] | 05 Apr 2012 |
Name/Description | Modified Date |
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Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English] | 13 Mar 2013 |
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English] | 13 Mar 2013 |
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English] | 13 Mar 2013 |
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English] | 13 Mar 2013 |
Test Fixtures for High Speed Logic (REV 1.0) PDF (341.0 kB) AN203 [English] | 02 Apr 1998 |
Transmission Lines and Terminations with Philips Advanced Logic Families (REV 1.0) PDF (217.0 kB) AN246 [English] | 01 Feb 1998 |
LVT (Low Voltage Technology) and ALVT (Advanced LVT) (REV 1.0) PDF (133.0 kB) AN243 [English] | 01 Jan 1998 |
Name/Description | Modified Date |
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ロジック製品セレクションガイド... (REV 1.0) PDF (38.3 MB) LOGIC_SELECTION_GUIDE_2015_JP [English] | 19 Nov 2015 |
Logic selection guide 2016 (REV 1.1) PDF (15.3 MB) 75017285 [English] | 08 Jan 2015 |
Name/Description | Modified Date |
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plastic compatible thermal enhanced extremely thin quad flat package; no leads (REV 1.1) PDF (217.0 kB) SOT1134-2 [English] | 10 Jun 2016 |
plastic thin shrink small outline package; 48 leads; body width 6.1 mm (REV 1.0) PDF (467.0 kB) SOT362-1 [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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TSSOP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 5.0) PDF (242.0 kB) SOT362-1_118 [English] | 15 Apr 2013 |
Name/Description | Modified Date |
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Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
Product | Status |
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74LVTN16245BDGG | Active |
74LVTN16245BBX | Active |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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74LVTN16245BDGG | SOT362-1 | SSOP-TSSOP-VSO-WAVE | Bulk Pack | Active | 74LVTN16245BDGG,12 (9352 891 18112) | LVTN16245B | 74LVTN16245BDGG | Always Pb-free | 70.8 | 1.33 | 7.52E8 | 1 | 1 | ||
Reel 13" Q1/T1 | Active | 74LVTN16245BDGG,11 (9352 891 18118) | LVTN16245B | 74LVTN16245BDGG | Always Pb-free | 70.8 | 1.33 | 7.52E8 | 1 | 1 | |||||
74LVTN16245BBX | SOT1134-2 | Reel 13" Q1/T1 in Drypack | Active | 74LVTN16245BBX,518 (9352 958 83518) | LVTN16245B | 74LVTN16245BBX | Always Pb-free | 70.8 | 1.33 | 7.52E8 | 2 | 2 |